Gemini-2

The main applications for the Gemini-2 are:

• Scribing micro-coax shields where the coax outer diameter is less than 0.01" (0.25 mm). The shield is tin dipped in order to create a solid mass of solder and braid. The machine is then programmed to cut a shallow groove (similar to scribing a line to cut glass) to allow the tinned braid to be snapped cleanly. All braid strands cut at the same position. As the laser beam does not penetrate the braid it does not matter what the underlying dielectric insulation composition is.
• Cutting aluminized mylar foil shields found in twin-ax type cables. The laser cuts right through the thin foil layer. The laser radiation does hit the underlying layers, so there is a small risk of heat damage. If the underlying plastic material is light colored (ideally white or transparent), the laser does not interact strongly and a robust cutting process can be developed for the foil. For dark colors (particularly black) it may be difficult to find settings that cut the foil without damaging the underlying insulation.