ISO 9001 | ISO 13485
ISO 9001 | ISO 13485
Prepare high-speed cable assemblies with a laser process developed for your jacket, shield, dielectric and termination geometry. Laser Wire Solutions evaluates cable construction, handling and inspection requirements to identify a suitable processing approach
Data centers power cloud computing and AI-driven innovation. As demand for faster transmission grows, precision in cable processing becomes non‑negotiable. Our laser wire stripping protects high‑speed cable integrity, minimizing signal loss and optimizing performance for next‑gen infrastructure.
Signal loss from imprecise cable prep
Inconsistent quality with manual methods
Delays & rework slowing installations
As data centers, SANs, and HPC systems scale, cable processing precision is no longer optional — it’s critical.
Laser Wire Solutions delivers flawless, contactless stripping for mission-critical speed.
No conductor bending — protects integrity
Residue-free for minimum dielectric gaps
Configurable workflow — semi-automated or fully automated
Single drain wire
Two drain wires
Twisted pairs
Twin Ax shields
Twin Ax jackets & dielectrics
Infiniband cables
Coaxial cables
AI infrastructure depends on high-speed interconnects between servers, switches, and storage systems. For cable assembly manufacturers supplying these applications, consistent preparation of jackets, shields, and dielectrics is an important part of producing reliable terminations.
Laser processing can support controlled material removal around the cable’s construction and required termination geometry. The process must be evaluated against both the physical preparation requirements and the performance criteria of the completed assembly.
Twinax and other shielded cable constructions require defined strip lengths, shield setbacks, and exposed conductor geometries. Developing the preparation process around these features helps manufacturers control the transition between the cable and connector.
Conductor condition, retained dielectric geometry, and shield integrity matter during cable preparation. Application-specific laser processing can target selected layers without blade contact, with inspection used to confirm the required result.
Production planning needs to account for loading, alignment, material removal, inspection, and downstream termination. LWS works with manufacturers to develop laser processing approaches around their cable construction, handling requirements, and production objectives.
A suitable laser process can remove targeted layers without blade contact. Results depend on cable construction, wavelength, and process parameters. Sample evaluation confirms conductor condition and the required strip geometry.
Residue depends on the material and removal method. We evaluate the processed surface against agreed acceptance criteria, including any subsequent removal or cleaning steps.
Lasers are suitable for a wide range of cable types, and it's highly likely that Laser Wire Solutions has seen your cable type. The best way to be sure, is to submit a free sample for processing.
The right machine depends upon your cable type or material which is used because different lasers interact with materials in different ways. The right machine for you may also be semi-automatic or fully automatic. The Laser Wire Solutions team can advise accordingly. Get in touch to find out more.