ISO 9001 | ISO 13485
Find out all the answers to the most frequently asked questions, covering everything from the wires we can strip, placing an order, and after sales support.
If your questions are not listed here, please get in touch.
Laser wire stripping uses controlled laser energy to remove insulation from a wire or cable without making mechanical contact with the conductor.
The laser wavelength and process parameters are selected according to the material being removed. This enables insulation to be ablated or cut with a highly controlled process while reducing the risk of damage associated with blades, abrasive tools or other contact-based stripping methods.
The purpose of a correctly developed laser stripping process is to remove the required insulation without compromising the underlying conductor.
Because laser stripping is non-contact, there is no blade applying mechanical force to the conductor, which removes one common source of conductor nicking.
The correct laser technology, wavelength and process parameters still need to be selected for the particular insulation and conductor combination. This is why Laser Wire Solutions evaluates applications and develops the process before recommending a production solution.
Laser stripping is particularly useful where mechanical stripping becomes difficult, inconsistent or introduces an unacceptable risk of conductor damage.
Typical examples include very fine wires, bonded insulation, complex cable constructions, non-round cables, window strips, multi-layer cables and applications where strip quality and repeatability are critical.
In many applications, yes.
Laser processing can provide a controlled alternative to chemical insulation removal without requiring operators to handle stripping chemicals. It can be particularly attractive for enamelled wires, fine wires and other applications where manufacturers are looking to reduce chemical handling or improve process control.
Suitability depends on the insulation material, conductor and required strip geometry, so the application should be evaluated before selecting the process.
Yes. Selective layer removal is one of the major advantages of laser processing.
Different laser wavelengths and process parameters interact differently with polymers and metals. This can allow insulation, coatings, foil, braid or other layers to be processed independently while preserving the layers that need to remain.
The exact process depends on the cable construction and materials involved.
Laser Wire Solutions works with a wide range of insulation materials, including polyimide, enamel and many polymer and fluoropolymer constructions.
Material absorption varies significantly between laser wavelengths, which is why there is no single laser technology that is ideal for every insulation.
Our applications engineers evaluate the material, conductor, geometry and required result before recommending the most appropriate process.
Yes. Fluoropolymers including PTFE, PFA, FEP and ETFE can be processed using appropriate laser technologies.
For particularly demanding applications, femtosecond laser processing can provide highly controlled material removal with minimal thermal impact.
Feasibility testing is recommended because fluoropolymer behaviour varies according to material formulation, thickness and the construction underneath it.
Yes.
UV and other laser technologies can remove enamel and bonded coatings from magnet wire without relying on mechanical scraping or chemical removal.
The appropriate technology depends on wire size, coating, conductor and production requirements
Yes. Laser processing can be used for operations including outer-jacket removal, shield processing and dielectric removal on micro-coax constructions.
It is particularly suited to fine, delicate cable constructions where conventional tooling becomes increasingly difficult to control.
Yes. Laser processing is not restricted to fine wire.
Large cables used in automotive, electrification and other high-power applications can also benefit from non-contact insulation removal, particularly where cable geometry, insulation thickness or conductor protection makes mechanical stripping challenging.
Laser processing is particularly well suited to fine wire applications where conventional stripping methods become increasingly difficult.
The minimum practical wire size depends on the conductor, insulation, construction and required strip geometry rather than wire gauge alone.
Laser Wire Solutions offers systems capable of processing extremely fine wire, and application testing can determine the appropriate process for a specific construction.
There is no single laser that is best for every wire.
CO₂, UV, fiber and femtosecond lasers interact differently with polymers, coatings and metals.
As a general guide, CO₂ lasers are widely used for polymer insulation; UV technology is well suited to highly controlled processing of fine and enamelled wires; fiber lasers can be used for metallic features and selected wire-processing applications; and femtosecond technology is suited to ultra-precise material removal where very low thermal impact is required.
The best technology is determined by the complete material stack and the result you need to achieve.
A femtosecond laser produces extremely short laser pulses.
The very short interaction time enables highly controlled material ablation before significant heat can transfer into the surrounding material. This makes femtosecond processing particularly useful for precision micro-machining, fluoropolymer ablation, tube drilling and applications where thermal damage needs to be minimised.
No.
We recommend starting with the application rather than selecting a laser first.
Tell us about the materials, component geometry, feature you need to create, tolerances, quality requirements and production volumes. Our applications engineers can then determine which processing technology and system configuration should be evaluated.
Yes.
Laser Wire Solutions provides application and process development from initial feasibility testing through process optimisation and preparation for production.
This allows the processing method, parameters, tooling, motion, vision and automation requirements to be established around the application before a production solution is finalised.
Yes.
Laser Wire Solutions provides application and process development from initial feasibility testing through process optimisation and preparation for production.
This allows the processing method, parameters, tooling, motion, vision and automation requirements to be established around the application before a production solution is finalised.
Laser processes can be controlled using stored recipes rather than relying on an operator to manually position or adjust a stripping tool.
Depending on the application, verification can include dimensional measurement, visual or microscopic inspection, process monitoring and other application-specific quality checks.
Critical process parameters and inspection requirements can be established as part of process development.
Mechanical stripping requires a blade or tool to operate very close to the conductor. Variation in wire position, conductor dimensions, blade wear or setup can therefore result in the conductor being contacted.
Laser stripping removes insulation without a mechanical cutting tool touching the wire.
Removing that mechanical interaction can significantly reduce the risk of conductor nicking, particularly on fine or high-value wires.
Yes.
Laser Wire Solutions develops processes with production deployment and validation requirements in mind.
Depending on the project, this can include controlled processing recipes, defined process parameters, inspection requirements, process monitoring, documentation and support for qualification activities.
Validation requirements should be discussed during process development so the equipment and process are designed around them from the outset.
Laser Wire Solutions can support customers preparing laser processes and equipment for regulated manufacturing environments.
The exact IQ, OQ and PQ requirements remain application- and customer-specific, but process parameters, machine functionality, operating ranges and inspection requirements can be established during development to support the customer’s validation strategy.
Laser processing equipment can be designed as an enclosed, interlocked workstation so operators are not exposed to the processing laser during normal production.
Suitable extraction is also required to control fumes and particulates created by the material-removal process.
The specific safety controls depend on the laser technology, application and system configuration.
An operator-safe laser workstation combines the laser source with an enclosed processing area, appropriate interlocks, machine controls and extraction provisions so the laser process can be used within a production environment.
This is particularly important for high-performance laser technologies such as femtosecond processing.
Laser processing converts a small amount of the material being removed into fumes and particulates.
Appropriate extraction captures these emissions at the process area and filters them before they can enter the surrounding production environment.
The extraction specification should be selected according to the material being processed and the laser application.
Yes.
Laser processing can range from manually loaded systems for lower-volume or flexible production through to automated and integrated solutions for high-volume manufacturing.
Fixtures, machine motion, vision, automation and part handling can all be developed around the required cycle time and production environment.
Yes.
Laser processes can be integrated with automation, machine vision, motion systems, component handling and upstream or downstream manufacturing operations.
For applications requiring integration, the laser process and automation strategy should ideally be developed together.
No.
Medical device manufacturers can use Laser Wire Solutions’ Medical Device Component Supply service to outsource precision laser processing rather than immediately bringing the process in-house.
This can be used for development builds, pilot production, production ramp-up or sustained volume manufacturing.
Yes.
Medical wire can be processed spool-to-spool where the downstream manufacturing process requires continuous material, or supplied as pre-cut laser-processed components.
The appropriate format depends on the customer’s assembly and manufacturing process.
Yes.
Laser Wire Solutions’ Medical Device Component Supply operation is certified to ISO 13485, supporting controlled production of laser-processed components for medical device manufacturers.
Yes.
Projects can begin with feasibility and process development before moving into pilot production, ramp-up and sustained manufacturing.
For some programmes, outsourced processing is also used as a bridge before eventually transferring the process to dedicated in-house equipment.
You do not need to select the system yourself.
Provide details of your wire or component, material construction, required process and expected production volumes. The LWS team can evaluate the application and recommend the most appropriate technology and equipment configuration.
Yes.
Use the Validate Your Application service to provide details of your wire, cable or component and the processing result you need.
We normally like to hold a short discovery call to full understand your requirements to ensure we process your material correctly soif you have not spoken to a member of the Laser Wire Solutions team or one of our trusted partners, we will be in touch to ensure we capture this information.
System cost depends on the laser technology, application, level of automation, tooling, vision, motion and other project-specific requirements.
For this reason, equipment is normally specified around the application before a quotation is prepared.
Laser Wire Solutions provides ongoing technical and customer support for installed systems.
Customers requiring technical assistance can raise a support ticket so the issue can be reviewed by the appropriate support team.
Laser Wire Solutions works with customers globally through its own teams and international partner network.
Contact us with your location and application and we can direct you to the appropriate sales or support contact.